Tripling processor power with Holo PureForm 3D printed liquid coolers
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Chip powers are on the rise and expected to double every 2-3 years for PCs and data centers. Never has there been a more urgent need for high performance cooling. Cofounder and chief strategy office, Arian Aghababaie, presents on how Holo PureForm™ technology coupled with nTop Platform can reduce energy consumption, enhance liquid cooling performance and increase processor powers. Arian will also walk through a real example of how a 3D printed pure copper liquid coldplate can triple the operating power of a high-end PC chip, demonstrating that design freedom for additive manufacturing creates value.
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